IEC 62999 Ed. 1.0 b:2016

Electric room heating – Underfloor heating – Performance characteristics – Definitions, method of testing, sizing and formula symbols
standard by International Electrotechnical Commission, 02/23/2016

IEC 62680-2 Ed. 1.0 b:2013

Universal serial bus interfaces for data and power – Part 2: Universal serial bus – Micro-USB cables and connectors specification, revision 1.01
standard by International Electrotechnical Commission, 09/11/2013

IEC 62751-2 Amd.1 Ed. 1.0 b:2019

Amendment 1 – Power losses in voltage sourced converter (VSC) valves for high-voltage direct current (HVDC) systems – Part 2: Modular multilevel converters
Amendment by International Electrotechnical Commission, 08/23/2019

IEC 62665 Ed. 2.0 en:2015

Multimedia systems and equipment – Multimedia e-publishing and e-books technologies – Texture map for auditory presentation of printed texts
standard by International Electrotechnical Commission, 12/11/2015

IEC 62817 Ed. 1.0 b:2014

Photovoltaic systems – Design qualification of solar trackers
standard by International Electrotechnical Commission, 08/25/2014

IEC 62851-1 Ed. 1.0 b:2014

Alarm and electronic security systems – Social alarm systems – Part 1: System requirements
standard by International Electrotechnical Commission, 04/10/2014

IEC 80601-2-71 Ed. 1.0 b:2015

Medical electrical equipment – Part 2-71: Particular requirements for the basic safety and essential performance of functional near-infrared spectroscopy (NIRS) equipment
standard by International Electrotechnical Commission, 06/09/2015

IEC 62660-3 Ed. 1.0 b:2016

Secondary lithium-ion cells for the propulsion of electric road vehicles – Part 3: Safety requirements
standard by International Electrotechnical Commission, 08/29/2016

IEC 62917 Ed. 1.0 b:2016

Railway applications – Fixed installations – Electric traction – Copper and copper alloy grooved contact wires
standard by International Electrotechnical Commission, 10/05/2016

IEC 62878-2-5 Ed. 1.0 en:2019

Device embedding assembly technology – Part 2-5: Guidelines – Implementation of a 3D data format for device embedded substrate
standard by International Electrotechnical Commission, 09/16/2019