Corrigendum 1 – Audio/video, information and communication technology equipment – Part 1: Safety requirements
Corrigenda by International Electrotechnical Commission, 06/28/2010
Dielectric and resistive properties of solid insulating materials – Part 1: General
standard by International Electrotechnical Commission, 04/28/2011
Amendment 1 – Metallic communication cable test methods – Part 4-7: Electromagnetic compatibility (EMC) – Test method for measuring of transfer impedance Z<sub>T</sub> and screening attenuation a<sub>S</sub> or coupling attenuation a<sub>C</sub> of connectors and assemblies up to and above 3 GHz – T
Amendment by International Electrotechnical Commission, 05/09/2018
Corrigendum 1 – Semiconductor devices – Micro-electromechanical devices – Part 9: Wafer to wafer bonding strength measurement for MEMS
Corrigenda by International Electrotechnical Commission, 03/08/2012
Fibre optic active components and devices – Performance standards – Part 7: 1 310-nm discrete vertical cavity surface emitting laser devices
standard by International Electrotechnical Commission, 03/29/2012
Integrated circuits – Measurement of electromagnetic immunity, 150 kHz to 1 GHz – Part 1: General conditions and definitions
standard by International Electrotechnical Commission, 01/19/2006
Ultrasonics – Hydrophones – Part 2: Calibration for ultrasonic fields up to 40 MHz
standard by International Electrotechnical Commission, 08/23/2007
Super video compact disc – Disc-interchange system-specification
standard by International Electrotechnical Commission, 07/21/2000
Passive RF and microwave devices, intermodulation level measurement – Part 5: Measurement of passive intermodulation in filters
standard by International Electrotechnical Commission, 01/16/2013
Dynamic modules – Part 1: Performance standards – General conditions
standard by International Electrotechnical Commission, 02/18/2016
