Corrigendum 1 – Semiconductor devices – Micro-electromechanical devices – Part 9: Wafer to wafer bonding strength measurement for MEMS
Corrigenda by International Electrotechnical Commission, 03/08/2012
Fibre optic active components and devices – Performance standards – Part 6: 650-nm 250-Mbit/s plastic optical fibre transceivers
standard by International Electrotechnical Commission, 09/04/2003
Electricity metering equipment (a.c.) – Particular requirements – Part 11: Electromechanical meters for active energy (classes 0,5, 1 and 2)
standard by International Electrotechnical Commission, 01/28/2003
Installed monitors for the control and detection of gamma radiations contained in recyclable or non-recyclable materials transported by vehicles
standard by International Electrotechnical Commission, 07/28/2004
Maritime navigation and radiocommunication equipment and systems – Bridge navigational watch alarm system (BNWAS)
standard by International Electrotechnical Commission, 02/11/2010
OPC unified architecture – Part 4: Services
standard by International Electrotechnical Commission, 10/20/2011
Fibre optic active components and devices – Test and measurement procedures – Part 4: Relative intensity noise using a time-domain optical detection system
standard by International Electrotechnical Commission, 11/20/2009
Electronic railway equipment – On-board multimedia and telematic subsystems for railways – Part 1: General architecture
standard by International Electrotechnical Commission, 02/17/2015
Audio/video, information and communication technology equipment – Environmentally conscious design
standard by International Electrotechnical Commission, 01/15/2008
Electricity metering equipment (AC) – General requirements, tests and test conditions – Part 11: Metering equipment
standard by International Electrotechnical Commission, 02/12/2003
