IEC 62150-4 Ed. 1.0 b:2009

Fibre optic active components and devices – Test and measurement procedures – Part 4: Relative intensity noise using a time-domain optical detection system
standard by International Electrotechnical Commission, 11/20/2009

IEC 62580-1 Ed. 1.0 b:2015

Electronic railway equipment – On-board multimedia and telematic subsystems for railways – Part 1: General architecture
standard by International Electrotechnical Commission, 02/17/2015

IEC 62075 Ed. 1.0 b:2008

Audio/video, information and communication technology equipment – Environmentally conscious design
standard by International Electrotechnical Commission, 01/15/2008

IEC 62052-11 Ed. 1.0 b:2003

Electricity metering equipment (AC) – General requirements, tests and test conditions – Part 11: Metering equipment
standard by International Electrotechnical Commission, 02/12/2003

IEC 62508 Ed. 1.0 b:2010

Guidance on human aspects of dependability
standard by International Electrotechnical Commission, 06/28/2010

IEC 62379-5-1 Ed. 1.0 b:2014

Common control interface for networked digital audio and video products – Part 5-1: Transmission over networks – General
standard by International Electrotechnical Commission, 07/09/2014

IEC 62368-1 Ed. 1.0 en CORR1:2010

Corrigendum 1 – Audio/video, information and communication technology equipment – Part 1: Safety requirements
Corrigenda by International Electrotechnical Commission, 06/28/2010

IEC 62631-1 Ed. 1.0 b:2011

Dielectric and resistive properties of solid insulating materials – Part 1: General
standard by International Electrotechnical Commission, 04/28/2011

IEC 62153-4-7 Amd.1 Ed. 2.0 b:2018

Amendment 1 – Metallic communication cable test methods – Part 4-7: Electromagnetic compatibility (EMC) – Test method for measuring of transfer impedance Z<sub>T</sub> and screening attenuation a<sub>S</sub> or coupling attenuation a<sub>C</sub> of connectors and assemblies up to and above 3 GHz – T
Amendment by International Electrotechnical Commission, 05/09/2018

IEC 62047-9 Ed. 1.0 b CORR1:2012

Corrigendum 1 – Semiconductor devices – Micro-electromechanical devices – Part 9: Wafer to wafer bonding strength measurement for MEMS
Corrigenda by International Electrotechnical Commission, 03/08/2012