Semiconductor devices – Micro-electromechanical devices – Part 25: Silicon based MEMS fabrication technology – Measurement method of pull-press and shearing strength of micro bonding area
standard by International Electrotechnical Commission, 08/29/2016
Electronic components – Long-term storage of electronic semiconductor devices – Part 5: Die and wafer devices
standard by International Electrotechnical Commission, 01/20/2017
Corrigendum 3 – High-voltage switchgear and controlgear – Part 102: Alternating current disconnectors and earthing switches
Corrigenda by International Electrotechnical Commission, 02/23/2005
Uninterruptible power systems (UPS) – Part 2: Electromagnetic compatibility (EMC) requirements
standard by International Electrotechnical Commission, 11/25/2016
Superconductivity – Part 22-1: Superconducting electronic devices – Generic specification for sensors and detectors
standard by International Electrotechnical Commission, 07/27/2017
Maritime navigation and radiocommunication equipment and systems – Presentation of navigation-related information on shipborne navigational displays – General requirements, methods of testing and required test results
standard by International Electrotechnical Commission, 07/25/2008
Mobile and fixed offshore units – Electrical installations – Part 2: System design
standard by International Electrotechnical Commission, 03/24/2005
Function blocks (FB) for process control and electronic device description language (EDDL) – Part 4: EDD interpretation
standard by International Electrotechnical Commission, 10/07/2015
Industrial communication networks – Profiles – Part 5-11: Installation of fieldbuses – Installation profiles for CPF 11
standard by International Electrotechnical Commission, 09/17/2013
Display lighting unit – Part 2-2: Measuring methods of LED light bars used in LCD BLUs
standard by International Electrotechnical Commission, 02/08/2018
