IEC 61860 Ed. 1.0 b:2000
Dimensions of low-profile cores made of magnetic oxides
standard by International Electrotechnical Commission, 07/31/2000
- Comments Off on IEC 61860 Ed. 1.0 b:2000
- IEC
Dimensions of low-profile cores made of magnetic oxides
standard by International Electrotechnical Commission, 07/31/2000
Semiconductor devices – Micro-electromechanical devices – Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials
standard by International Electrotechnical Commission, 04/05/2019
Electronic design interchange format (EDIF) – Part 2: Version 4 0 0. (This publication is available in electronic HTML format only)
standard by International Electrotechnical Commission, 01/31/2000
Medical electrical equipment – Medical image display systems – Part 1: Evaluation methods
standard by International Electrotechnical Commission, 12/10/2009
Field device tool (FDT) interface specification – Part 303-1: Communication profile integration – IEC 61784 CP 3/1 and CP 3/2
standard by International Electrotechnical Commission, 06/30/2009
Electric and magnetic field levels generated by AC power systems – Measurement procedures with regard to public exposure
standard by International Electrotechnical Commission, 08/31/2009
Digital audio – Interface for non-linear PCM encoded audio bitstreams applying IEC 60958 – Part 2: Burst-info
standard by International Electrotechnical Commission, 05/23/2007
Amendment 1 – LED modules for general lighting – Safety specifications
Amendment by International Electrotechnical Commission, 10/30/2012
Time relays for industrial and residential use – Part 1: Requirements and tests
standard by International Electrotechnical Commission, 05/25/2011
Multimedia systems and equipment – Colour measurement and management – Part 2-4: Colour management – Extended-gamut YCC colour space for video applications – xvYCC
standard by International Electrotechnical Commission, 01/17/2006