Semiconductor devices – Micro-electromechanical devices – Part 8: Strip bending test method for tensile property measurement of thin films
standard by International Electrotechnical Commission, 03/14/2011
Industrial-process measurement and control – Data structures and elements in process equipment catalogues – Part 21: List of Properties (LOP) of automated valves for electronic data exchange – Generic structures
standard by International Electrotechnical Commission, 09/15/2015
Electric vehicle conductive charging system – Part 21-2: Electric vehicle requirements for conductive connection to an AC/DC supply – EMC requirements for off board electric vehicle charging systems
standard by International Electrotechnical Commission, 04/18/2018
Industrial communication networks – Profiles – Part 3-14: Functional safety fieldbuses – Additional specifications for CPF 14
standard by International Electrotechnical Commission, 06/29/2010
Fibre optic active components and devices – Reliability standards – Part 3: Laser modules used for telecommunication
standard by International Electrotechnical Commission, 06/19/2014
Amendment1 – Field device tool (FDT) Interface specification – Part 315: Communication profile integration – IEC 61784 CPF 15
Amendment by International Electrotechnical Commission, 06/17/2016
Connectors – Safety requirements and tests
standard by International Electrotechnical Commission, 06/20/2001
Heat shrinkable moulded shapes – Part 1: Definitions and general requirements
standard by International Electrotechnical Commission, 11/21/2005
Determination of certain substances in electrotechnical products – Part 7-2: Hexavalent chromium – Determination of hexavalent chromium (Cr(VI)) in polymers and electronics by the colorimetric method
standard by International Electrotechnical Commission, 03/28/2017
Railway applications – Fixed installations – DC switchgear – Part 2: DC circuit-breakers
standard by International Electrotechnical Commission, 02/07/2006
