Security for industrial automation and control systems – Part 4-2: Technical security requirements for IACS components
standard by International Electrotechnical Commission, 02/27/2019
Metallic communication cable test methods – Part 4-9: Electromagnetic compatibility (EMC) – Coupling attenuation of screened balanced cables, triaxial method
standard by International Electrotechnical Commission, 03/18/2008
Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-2: Shear strength test
standard by International Electrotechnical Commission, 05/14/2008
Multimedia systems and equipment – Colour measurement and management – Part 12-1: Metadata for identification of colour gamut (Gamut ID)
standard by International Electrotechnical Commission, 01/12/2011
Nuclear instrumentation – Geophysical borehole instrumentation to determine rock density ('density logging')
standard by International Electrotechnical Commission, 10/30/1998
Common control interface for networked digital audio and video products – Part 7: Measurements
standard by International Electrotechnical Commission, 06/16/2015
Metallic cables and other passive components – Test methods – Part 4-8: Electromagnetic compatibility (EMC) – Capacitive coupling admittance
standard by International Electrotechnical Commission, 06/25/2018
Nuclear power plants – Instrumentation and control systems important to safety – Requirements for coping with common cause failure (CCF)
standard by International Electrotechnical Commission, 12/07/2007
Superconductivity – Part 16: Electronic characteristic measurements – Power-dependent surface resistance of superconductors at microwave frequencies
standard by International Electrotechnical Commission, 01/16/2013
Exposure to electric or magnetic fields in the low and intermediate frequency range – Methods for calculating the current density and internal electric field induced in the human body – Part 3-1: Exposure to electric fields – Analytical and 2D numerical models
standard by International Electrotechnical Commission, 05/23/2007
