IEC 61156-8 Ed. 1.1 en:2013

Multicore and symmetrical pair/quad cables for digital communications – Part 8: Symmetrical pair/quad cables with transmission characteristics up to 1 200 MHz – Work area wiring – Sectional specification CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 05/28/2013

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IEC 61249-5-4 Ed. 1.0 b:1996

Materials for interconnection structures – Part 5: Sectional specification set for conductive foils and films with or without coatings – Section 4: Conductive inks
standard by International Electrotechnical Commission, 06/18/1996

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IEC 61248-1 Ed. 1.0 b:1996

Transformers and inductors for use in electronic and telecommunication equipment – Part 1: Generic specification
standard by International Electrotechnical Commission, 06/06/1996

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IEC 61192-5 Ed. 1.0 b:2007

Workmanship requirements for soldered electronic assemblies – Part 5: Rework, modification and repair of soldered electronic assemblies
standard by International Electrotechnical Commission, 05/23/2007

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IEC 61543 Amd.2 Ed. 1.0 b:2005

Amendment 2 – Residual current-operated protective devices (RCDs) for household and similar use – Electromagnetic compatibility
Amendment by International Electrotechnical Commission, 11/23/2005

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IEC 61400-21 Ed. 2.0 b:2008

Wind turbines – Part 21: Measurement and assessment of power quality characteristics of grid connected wind turbines
standard by International Electrotechnical Commission, 08/13/2008

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IEC 61291-2 Ed. 3.0 b:2012

Optical amplifiers – Part 2: Digital applications – Performance specification template
standard by International Electrotechnical Commission, 01/10/2012

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IEC 61156-1 Ed. 3.1 b:2009

Multicore and symmetrical pair/quad cables for digital communications – Part 1: Generic specification CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 10/14/2009

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IEC 61300-2-5 Ed. 3.0 en:2009

Fibre optic interconnecting devices and passive components – Basic test and measurement procedures – Part 2-5: Tests – Torsion
standard by International Electrotechnical Commission, 01/12/2009

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IEC 61190-1-3 Ed. 2.1 b:2010

Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 11/10/2010

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