ASTM Volume 10.04:2018

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Published annually in April.

This volume contains 141 standards.

Subjects cover:

  • Innerlayer Interconnections and Bonding
  • Materials and Processes for Vacuum Tubes
  • Electronic Device Characterization
  • Hermetic Seals
  • Hybrid Circuits and Substrates
  • Microelectronic Packaging
  • Leak Testing
  • and more
    This volume also includes the latest standards relating to

  • Declarable substances in materials
  • 3D imaging systems
  • Additive manufacturing technologies

Product Details

Published:
04/01/2018
ISBN(s):
9781682214664
Number of Pages:
1064
Part of:
ASTM Section 10:2018

ASTM Volume 10.04:2019

Click here to purchase
Published annually in April.

This volume contains 148 standards.

Subjects cover:

  • Innerlayer Interconnections and Bonding
  • Materials and Processes for Vacuum Tubes
  • Electronic Device Characterization
  • Hermetic Seals
  • Hybrid Circuits and Substrates
  • Microelectronic Packaging
  • Leak Testing
  • and more
    This volume also includes the latest standards relating to

  • Declarable substances in materials
  • 3D imaging systems
  • Additive manufacturing technologies

Product Details

Published:
04/01/2019
ISBN(s):
9781682215678
Number of Pages:
1164