IEC 60191-6-2 Ed. 1.0 b:2001

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IEC 60191-6-2:2001 covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).

Product Details

Edition:
1.0
Published:
12/11/2001
Number of Pages:
21
File Size:
1 file , 250 KB

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