IEC 62047-16 Ed. 1.0 b:2015
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IEC 62047-16:2015 specifies the test methods to measure the residual stresses of films with thickness in the range of 0,01 μ to 10 μ in MEMS structures fabricated by wafer curvature or cantilever beam deflection methods.
Product Details
- Edition:
- 1.0
- Published:
- 03/05/2015
- Number of Pages:
- 21
- File Size:
- 1 file , 420 KB
