IEC 62137-1-2 Ed. 1.0 en:2007
- Comments Off on IEC 62137-1-2 Ed. 1.0 en:2007
- IEC
Click here to purchase
The test method is applicable to leadless surface mounting components and surface mounting connectors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads. The method is designed to test and evaluate the endurance of the solder joint between component terminals and lands on a substrate, by means of a shear type mechanical stress. This test is applicable to evaluate the effects of repeated temperature change on the strength of the solder joints between terminals and lands on a substrate.
Product Details
- Edition:
- 1.0
- Published:
- 07/25/2007
- Number of Pages:
- 17
- File Size:
- 1 file , 290 KB
