JEDEC JESD217

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This publication provides an overview of solder void types, outlines current metrologies and test methods used for pre-SMPT solder void characterization and potential limitations, and prescribes sampling strategy for data collection, and tolerance guidelines for corrective measures.

Product Details

Published:
09/01/2010
Number of Pages:
44
File Size:
1 file , 1.8 MB

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