JEDEC JESD22-B108B

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The purpose of this test is to measure the deviation of the terminals (leads or solder balls) from coplanarity at room temperature for surface-mount semiconductor devices. This test method is applicable for inspection and device characterization. If package warpage or coplanarity is to be characterized at reflow soldering temperatures, then JESD22-B112 should be used.

Product Details

Published:
09/01/2010
Number of Pages:
14
File Size:
1 file , 54 KB

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