JEDEC JESD22-B116A

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This test provides a means for determining the strength of a gold ball bond to a die bonding surface or an aluminum wedge or stitch bond to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts. The wire bond shear test is destructive. It is appropriate for use in process development, process control and/or quality assurance.

Product Details

Published:
08/01/2009
Number of Pages:
17
File Size:
1 file , 220 KB

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