JEDEC JESD51-3

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This standard describes design requirements for a single layer, leaded surface mount integrated circuit package thermal test board. The standard describes board material and geometry requirements, minimum trace lenghts, trace thickness, and routing considerations. Application includes still air and moving air thermal tests.

Product Details

Published:
08/01/1996
Number of Pages:
11
File Size:
1 file , 330 KB

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