IPC SM-784

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Discusses chip types, board selection, design issues and thermal transfer methods for Chip on Board (COB) applications. Details wire bonding, TAB and flip chip designs and provides information on mounting materials, including adhesives, wires and various mechanical bonding techniques.

Product Details

Published:
11/01/1990
Number of Pages:
37
File Size:
1 file , 440 KB
Product Code(s):
SM-784(D)1

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